Close-up front view of Estone BIS-2639
Estone BIS-2639
Rear view of Estone BIS-2639
Angled rear view of Estone BIS-2639
Close-up front view of Estone BIS-2639
Estone BIS-2639
Rear view of Estone BIS-2639
Angled rear view of Estone BIS-2639

i.MX8M Fanless Industrial PC | BIS-2639

The BIS-2639-TSI is a compact and fanless IoT gateway embedded PC powered by the NXP i.MX8M Plus quad-core application processor. Designed with long-term reliability and industrial stability, it provides dual Gigabit Ethernet ports, PoE capability, and multiple serial interfaces to meet diverse connectivity needs. With onboard LPDDR4 memory, industrial-grade flash storage, HDMI display output, and modular wireless expansion via M.2 sockets, this gateway is highly adaptable for communication-intensive or edge-AI scenarios. The robust fanless aluminum enclosure with VESA and DIN-rail mounting options makes it ideal for smart gateway, industrial automation, digital signage, kiosks, and various embedded applications.

Key Features

NXP i.MX8M Plus Quad-core Application Processor, Long Life Cycle
Onboard 4GB LPDDR4 Memory and High-Endurance iNAND Flash Storage
Dual Gigabit Ethernet Ports with 12–36V AC/DC Power Input and PoE via RJ-45
Multiple Industrial Serial Interfaces: RS-232, Dual RS-485
Rich Wireless Expansion Options via M.2 Sockets (WiFi/BT, LTE/5G, NVMe SSD)
HDMI Display Output and USB 3.0 (Type-A & Type-C OTG) Interfaces
Built-in TPM 2.0 Security Module (Infineon SLB 9673)
Wide Operating Temperature −20°C to +70°C
Fanless Aluminum Enclosure with VESA Mount / DIN-Rail Support
Specifications
SYSTEM
I/O INTERFACE
POWER
MECHANICAL
ENVIRONMENTAL
SYSTEM
Processor i.MX 8M Plus, 4 x ARM Cortex-A53 @ 1.6GHz
Memory On-board 4GB LPDDR4
Storage On-board iNAND flash (32GB default), 
265K EEPROM with write protect control
SDIO Micro SD card socket
OS

Yocto Embedded Linux with source code from NXP i.MX8MP EVK reference design, custom drivers

RTC

Included

Security

Infineon SLB 9673 TPM2.0

I/O INTERFACE
Display Interface HDMI
l/O Ports 2 x GbE via RJ-45
2 x USB 3.0 Type A, 1 x USB 3.0 Type C OTG
2 x RS-485 via terminal block
1 x RS-232 via DB9
Internal Expansion

1 x M.2 E-key socket (Wifi/BT) SDIO, USB 2.0, I2C, UART

1 x M.2 B-key socket (LTE/5G) USB 3.0, I2C
1 x M.2 M-key socket (SSD), dedicated PCIe 3.0
1 x Lane for NVMe

Antenna

4 x u.FL to SMA bulkhead connectors

Software update interface

USB or micro SD

POWER
Power Input

12-36V AC/DC power input via terminal block,

12V DC via barrel jack, POE via RJ-45

MECHANICAL
Enclosure Material Aluminum
Enclosure Color Black
Dimensions 170 x 124 x 39 mm 
Mounting Option Support 75 x 75mm VESA Mount
or DlN-Rail Mount with Optional Bracket
Cooling Fanless
ENVIRONMENTAL
Operation Temperature -20°C to 70°C
Storage Temperature -40°C to 85°C
Environmental IP-20 or better